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				<P ALIGN=RIGHT><FONT COLOR="#ffffff"><FONT FACE="Verdana"><FONT SIZE=2><B><FONT SIZE=4>Frequently Asked

				Questions </FONT></B></FONT></FONT></FONT>				</P>

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				<P><B><FONT SIZE=2><FONT FACE="Verdana">General</FONT></FONT></B>			  </P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.1. What are the

				differences between M, CD and FD designs of IMEs?</B> </FONT></FONT>				</P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The M or monolithic design

				is a single pair of electrodes that are interdigitated. The CD or

				combined differential is a dual design, or two pairs of

				interdigitated electrodes. However, in the CD design, the two

				pairs share a common central electrode that has fingers in two

				directions; towards the other electrodes and thus serves as an

				exposed gate electrode. The FD or full differential design

				comprises two completely separate pairs of electrodes and thus

				has four leads and may be thought of as two discrete M designs on

				a single chip. </FONT></FONT>				</P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.2. Why does ABTECH

				offer these different designs?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The M, CD and FD designs

				afford you flexibility in the way the IMEs are used. M for simple

				materials characterizations, CD for field-gated phenomena and FD

				for ratiometric analytical measurements.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.3. How is the M device

				design used?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The M design may be used as

				a simple, two-electrode (anode and cathode) electrochemical cell

				(electrolysis) or in the measurement of resistance (DC

				resistivity or conductivity) or electrical impedance (AC

				impedance) of films placed on or between the digits of the

				device.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.4. How is the CD device

				design used?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The CD design allows a

				polymer film to be cast, grown or deposited over all three

				electrodes and then have the outer two electrodes be used much

				like an M device (DC or AC). However, an additional potential may

				be applied to the central electrode to potentiate the properties,

				and hence response, of the polymer film. The electrical behavior

				of the polymer film could thus be altered by the electric field

				applied to the central gating electrode. This arrangement

				requires a bi-potentiostat or other measurement configuration.

				The gated electrode may also be &ldquo;buried&rdquo; by an

				insulating layer.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.5. How is the FD device

				design used?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The FD device can be thought

				of as two separate M designs on a single chip. This allows the

				possibility of a ratiometric measurement, that is, the response

				of one region of interdigitation relative to the other. The FD

				device may also be prepared with two entirely different polymer

				films or biological molecules (enzymes, DNA, etc) on each of the

				two regions of interdigitation. In this way the FD might be used

				to measure two distinct analytes in the same test medium.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.6. Why does ABTECH

				offer these devices with different conductors?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>ABTECH&rsquo;s IME, IAME and

				IAIME are available in three different conductors gold (Au),

				platinum (Pt) and ITO. These conductors, while generally inert,

				each have different work functions, different surface energies,

				different surface chemistries, and different bio-contact

				properties. This gives then unique properties. Au for example is

				readily modified with alkane thiols, ITO is readily modified with

				organosilanes, and Pt is easily platinized to be rendered

				catalytic.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.7. What is the

				difference between packaged (P) and unpackaged (U) devices?</B></FONT></FONT></P>

				<P><FONT SIZE=2><FONT FACE="Verdana">ABTECH&rsquo;s IMEs are

				available as packaged and unpackaged devices. Unpackaged (U)

				devices are microlithographically fabricated chips possessing

				patterns of conductors on an insulating substrate. The unpackaged

				device is supplied as a die without lead wires and without any

				form of encapsulation. The packaged (P) device is provided with a

				suitable chip carrier / leadwire construct and the points of

				attachment of the bonding pads of the chip to the chip carrier is

				encapsulated in suitable (usually epoxy) resin.

				<A HREF="imep-animated.html">http://www.abtechsci.com/imep-animated.html</A></FONT></FONT></P>

				<P STYLE="font-style: normal"><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>Q.8.

				Why do packaged IMEs require a two&ndash;week lead-time?</B></FONT></FONT></P>

				<P STYLE="font-weight: medium"><FONT FACE="Verdana"><FONT SIZE=2>Packaged

				items require a two-week lead time as chips are taken out of

				inventory in response to a customer's order and are then packaged

				accordingly. Because packaging (encapsulation with a suitable

				epoxy resin) limits user flexibility with regard to coating

				methods, ABTECH prepares packaged chips only in response to

				confirmed purchase orders or receipt of credit cards. Packaged

				items are thus not kept in inventory and must thus be prepared in

				response to a confirmed purchase.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.9. What is a STC Test

				Clip and how is it used?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The STC test clip is the

				correct connector for all IME chips. The STC is a spring-loaded

				pinch clip that allows easy and convenient make/break electrical

				connection to the bonding pads of the various IME dies. The STC

				possess four leads that terminate in four spring-loaded gold

				contacts within the jaw of the STC Test Clip. The electrical

				contacts of the test clip match and mate to the bonding pads of

				the die. To use the test clip, its jaws are opened and the die is

				inserted such that the conductive bonding pads of the die mate

				with the conductors of the test clip upon its closure. Check for

				connectivity using a multimeter.</FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2><B>Q.10. We are interested

				in buying IAME chips and adapters. We wish to use these chips for

				measuring the electrical activities of cells. We wonder if it is

				at all possible to do this using your IAME chips and, if so,

				whether someone has done it before. Also, what instrumentation

				does one need to perform measurements?</B></FONT></FONT></P>

				<P><FONT FACE="Verdana"><FONT SIZE=2>The IAME and the IAIME chips

				may both be used for measuring the electrical impedance

				characteristics of living cells. The cells must first be cultured

				to full confluence on the chip, they must also adhere to the chip

				and an impedance analyzer or lock-in amplifier could be used to

				obtain the real and imaginary components of the impedance of the

				cells as a function of time. To achieve cell growth on the chip a

				culture chamber must be installed over the electrode fingers of

				the chip. Moreover, chemistries appropriate for the

				immobilization of the cells (ECM proteins of amino acid

				sequences) must first be immobilized to the chip.</FONT></FONT></P>

				<P><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>Q.11. Is the

				IAME wand adapter a one-time use adapter or can it be reused for

				connection to multiple IAMEs?</B></FONT></FONT></P>

				<P STYLE="margin-top: 0.17in"><FONT SIZE=2><FONT FACE="Verdana, sans-serif">While

				it is possible to use one wand with multiple </FONT></FONT><A HREF="imep-animated.html"><FONT SIZE=2><FONT FACE="Verdana, sans-serif">IAME

				chips</FONT></FONT></A> <FONT SIZE=2><FONT FACE="Verdana, sans-serif">or

				IME Chips, they were designed to be used as one wand per chip.

				The chip is typically glued (Crazy Glue&reg; - cyanoacrylate) to

				the wand and then the electrical contacts established using a

				conductive epoxy or low temperature solder. To use a single wand

				and multiple chips will require that you invent a method of

				attachment and detachment (other than gluing) and a method for

				making and breaking (other than conductive epoxy) the electrical

				contacts from wand to chip. <B>It is therefore advised that you

				purchase as many wands as you purchase chips. </B>Please take a

				look at this animation of IAME chip packaging.

				</FONT></FONT><A HREF="imep-animated.html"><FONT SIZE=2><FONT FACE="Verdana, sans-serif">http://www.abtechsci.com/imep-animated.html</FONT></FONT></A></P>

				<P><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>Q.12</B><B>.

			    To what temperature can I heat my IME/IAME/IAIME/MDEA Chip?</B></FONT></FONT></P>

				<P><FONT SIZE=2><FONT FACE="Verdana, sans-serif">Our chips are fabricated from Schott D263 borosilicate glass and possess an appropriately patterned conductor. These devices are manufactured for RT use and are suitable for modest variations above and below RT. However, it is possible to use these devices at elevated temperatures as well as at cryogenic temperatures. The glass transition temperature, Tg, or softening point for Schott D263 is given by Schott as 557oC. Above this temperature the substrate looses its dimensional stability.</FONT></FONT></P>

				<P><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>Q.1</B>3<B>.

				  I have purchased an IAME / IME Chip and IAME / IME Wand Adapter.

				  How do I make connection of the wand to the chip?</B> </FONT></FONT>			  </P>

				<P><FONT SIZE=2><FONT FACE="Verdana, sans-serif">We recommend,

				without guarantee, the use of a conductive two-part epoxy such as

				that from Circuit Works CW2400 Part A and CW2400 Part B

				</FONT></FONT><A HREF="..\www.chemtronics.com\index.html"><FONT SIZE=2><FONT FACE="Verdana, sans-serif">www.Chemtronics.com</FONT></FONT></A><FONT SIZE=2><FONT FACE="Verdana, sans-serif">.

				Also, you may solder the connection if you have access to a

				temperature controlled solder station.</FONT></FONT></P>

				<P><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>Q.1</B>4<B>.

				  I have purchased IMEs and wish to measure conductivity of a well-studied material so that I may obtain cell constants and calibrate the electrode.

			    What is a suitable material to use</B></FONT></FONT><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>?</B> </FONT></FONT> </P>

				<P><FONT SIZE=2><FONT FACE="Verdana, sans-serif">We recommend,

			    without guarantee, the use of standard conductance solutions of potassium chloride (KCl) at constant temperature (25C) according to <a href="..\www.iso.org\iso\catalogue_detail.htm_csnumber=14838">ISO 7888:1985</a>. Such solutions are commercially available from VWR, Fischer Scientific, Sigma Aldrich, etc. and vary in conductance values from 0.147 to 12.90 mS/cm. <span class="style1">See Y. C. Wu and P. A. Berezansky, &quot;Low Electrolytic Conductivity Standards&quot;<a href="..\nvl.nist.gov\pub\nistpubs\jres\100\5\j15wu.pdf"> <em>J. Res. Natl. Inst. Stand. Technol.</em></a> (<strong>1995</strong>) 100, 521 and Liju Yang, Adilah Guiseppi-Wilson and Anthony Guiseppi-Elie &quot;Design considerations in the use of interdigitated microsensor   electrode arrays (IMEs) for impedimetric characterization of biomimetic   hydrogels&quot;</span> <a href="..\www.springerlink.com\content\305371556vqj3630\index.html" title="Link to the Journal of this Article" lang="en"><em>Biomedical   Microdevices</em></a> (<strong>2010</strong>) DOI: 10.1007/s10544-010-9492-4.</FONT></FONT></P>

				<P><FONT FACE="Verdana, sans-serif"><FONT SIZE=2><B>Q.1</B>5<B>.

				  I have purchased  IAME / IME / PME / MDEA or other chip and wish to know, for my thesis or publication, know exactly how  these devices are manufactured?</B> </FONT></FONT> </P>

				<P><FONT SIZE=2><FONT FACE="Verdana, sans-serif">The exact process details of  manufacture (pressures, times, temperatures, etc.) are proprietary. However, the general technical description of the manufacture of these chips have been published and may be found in such peer-reviewed journal articles as</FONT></FONT></P>

				<ul>

				  <li>Liju Yang, Adilah Guiseppi-Wilson and Anthony Guiseppi-Elie &quot;Design considerations in the use of interdigitated microsensor   electrode arrays (IMEs) for impedimetric characterization of biomimetic   hydrogels&quot; <a href="..\www.springerlink.com\content\305371556vqj3630\index.html" title="Link to the Journal of this Article" lang="en"><em>Biomedical   Microdevices</em></a> (<strong>2010</strong>) DOI: 10.1007/s10544-010-9492-4.</li>

				  <li><strong>Anthony Guiseppi-Elie</strong>, Abdur Rub Abdur  Rahman and Nikhil K. Shukla &ldquo;SAM-modified Microdisc Electrode Arrays (MDEAs)  With Functionalized Carbon Nanotubes&rdquo; <em>Elctrochimica Acta</em> <strong>(2010)</strong> 55(14), 4247-4255<strong>&nbsp; </strong><img width="1" height="10" src="faqs_clip_image002.gif"><a href="..\dx.doi.org\10.1016\j.electacta.2008.12.043" target="doilink">doi:10.1016/j.electacta.2008.12.043</a></li>

				  <li>Abdur Rub Abdur Rahman, Gusphyl Justin, Adilah  Guiseppi-Wilson and Anthony Guiseppi-Elie* &ldquo;Fabrication and Packaging of a Dual Sensing  Electrochemical Biotransducer for Glucose and Lactate Useful in Intramuscular  Physiologic Status Monitoring&rdquo; <em>IEEE Sensors Journal</em> (<strong>2009</strong>)  9(12): 1856-1863&nbsp; <a href="..\dx.doi.org\10.1109\JSEN.2009.2031347">doi:  10.1109/JSEN.2009.2031347</a> (IF=1.17)</li>

				  <li>Abdur Rub Abdur Rahman and <strong>Anthony  Guiseppi-Elie</strong> &ldquo;Design  Considerations in the Development and Application of Microdisc Electrode Arrays  (MDEAs) for Implantable Biosensors&rdquo; <em>Biomedical  Microdevices: BioMEMS and Biomedical NanoTechnology</em> <strong>(2009) </strong>11:701-710. <a href="..\www.doi.org\10.1007\s10544-008-9283-3.html">http://www.doi.org/10.1007/s10544-008-9283-3</a> (IF=2.92) </li>

			  </ul>				<P>s</P></TD>

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Virginia 23219<BR>

Telephone Number: +1-804-783-7829 Fax Number:

+1-804-783-7830<BR>e-mail: <A HREF="mailto:[email protected]">[email protected]</A></FONT></FONT></P>

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