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<td WIDTH="100%"><p ALIGN="left" class="style1"> <b> (animated) INTERDIGITATED MICROSENSOR ELECTRODES</b><sup>TM</sup><b> (IMEs)<br>
<small>(Microfrabricated Inerdigitated
Electrode Arrays (IDAs))</small></b></td>
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<td width="42%"><p align="center"><img src="gifs/IME-zoom-animation.gif" width="300"
height="300" alt="IME-zoom-animation.gif (88229 bytes)"></td>
<td BGCOLOR="#e2ebf3" WIDTH="58%"><p align="center" class="style2"><u>IME Visualization</u></p>
<blockquote>
<p class="style2"><small>The graphic to the left illustrates the pattern of
interdigitation of the electrodes. As one zooms in, you begin to see the individual digits
of the electrodes separated by mere microns. The digits are metal and the interdigit
spaces are glass.</small></p>
</blockquote></td>
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<td width="42%"><p align="center"><img src="gifs/IME-fab-animation.gif" width="300"
height="300" alt="IME-fab-animation.gif (182086 bytes)"></td>
<td BGCOLOR="#e2ebf3" width="58%"><p align="center"><font FACE="Verdana,Arial" size="+1">
</font><u><span class="style2">Steps in IME Fabrication</span></u> </p>
<ol>
<li class="style2"><small>A titanium-tungsten (Ti/W) layer is first sputter-deposited
onto the borosilicate glass substrate. </small></li>
<li class="style2"><small>The second layer applied is either gold (Au) or platinum
(Pt). </small></li>
<li class="style2"><small>Using microlithographic techniques, one of our IME patterns
is formed from the metal layers. </small></li>
<li><small><span class="style2">Finally, a silicon nitride layer covers the
chip and is windowed using a fluorocarbon plasma to expose the interdigitaton and bonding
pads.</span> <br>
</small> </p>
</li>
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